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Switching Diodes
MA3X100 (MA10100)
Silicon epitaxial planar type
Unit: mm
For switching circuits Features
* High breakdown voltage: VR = 200 V * Small terminal capacitance
3
0.3+0.1 -0
0.15+0.1 -0.05
1.250.1 2.10.1
1 2 (0.65) (0.65)
0.90.1
Absolute Maximum Ratings Ta = 25C
Parameter Reverse voltage (DC) Repetitive peak reverse voltage Average forward current Repetitive peak forward current Non-repetitive peak forwardsurge-current * Junction temperature Storage temperature Note) *: t = 1 s Symbol VR VRRM IF(AV) IFRM IFSM Tj Tstg Rating 200 250 100 225 500 150 -55 to +150 Unit V V
5
1.30.1 2.00.2
0 to 0.1
mA mA mA C C
1: Anode 2: N.C. 3: Cathode
SMini3-F1 Package
Marking Symbol: M3A Internal Connection
3
1
2
Electrical Characteristics Ta = 25C 3C
Parameter Reverse current (DC) Forward voltage (DC) Terminal capacitance Reverse recovery time * Symbol IR VF Ct trr VR = 200 V IF = 100 mA VR = 0 V, f = 1 MHz IF = IR = 10 mA Irr = 1 mA , RL = 100 Conditions Min Typ Max 1.0 1.2 3.0 60 Unit A V pF ns
Note) 1. Rated input/output frequency: 20 MHz 2. *: trr measuring instrument
Bias Application Unit N-50BU tr 10% Input Pulse tp t IF trr t Irr = 1 mA IF = IR = 10 mA RL = 100 Output Pulse
A
VR Pulse Generator (PG-10N) Rs = 50 Wave Form Analyzer (SAS-8130) Ri = 50
90% tp = 2 s tr = 0.35 ns = 0.05
Note) The part number in the parenthesis shows conventional part number.
Publication date: July 2002 SKF00063AED
(0.15)
(0.425)
5
1
MA3X100
IF V F
103
I R VR
103 102
2.0
Ct VR
102
Ta = 150C
Terminal capacitance Ct (pF)
200 250
Forward current IF (mA)
Ta = 150C
Reverse current IR (nA)
10 100C 1 10-1 10-2 10-3 10-4 25C
1.5
10 100C 1
25C
1.0
10-1
-20C
0.5
10-2
10-3
0
0.2
0.4
0.6
0.8
1.0
1.2
0
50
100
150
0
0
50
100
150
200
Forward voltage VF (V)
Reverse voltage VR (V)
Reverse voltage VR (V)
2
SKF00063AED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL

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